Booth Application
E-newsettler
IICIE at a Glance
Exhibitor/Product List
International Integrated Circuit Innovation Expo (IICIE 2026), with the theme of "Cross-Industry Integration · Full-Chain Collaboration: Building a Distinctive IC Ecosystem", it is dedicated to building a high-end platform for the entire semiconductor industry chain, connecting global resources, and empowering collaborative innovation and value realisation of the global semiconductor industry.
Covering the full industry ecosystem, including IC products and applications, wafer manufacturing, packaging and testing, semiconductor equipment, semiconductor materials and key components. The expo enables direct engagement with key players in core semiconductor sectors including IDM, Fabless, Fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, optoelectronics, new energy and other fields, delivering one-stop efficient business connections, precise matchmaking and cutting-edge industry exchanges.
Chip
AI Chip, Communication Chip, Memory Chip, CPU Chip, Sensor Chip, Analog Chip, Digital Chip, Power Management and Power Chip, RF Chip, Driver Chip, etc.
Design /Manufacturing
IP / EDA (Electronic Design Automation), Fabless, Foundry, OSAT (Outsourced Semiconductor Assembly and Testing), Testing Services, etc.
Semiconductor Equipment
Fabrication Equipment, Packaging Equipment, Inspection and Testing Equipment, Assembly Equipment, Environmental Control Equipment, Factory Automation / Robots, etc.
Semiconductor Material
Substrate Material, Manufacturing Material, Packaging Material, etc.
Semiconductor Core Parts
Sealing Ring, Precision Bearing, Metal Part, Quartz / Silicon / Sic / Ceramic Component, Power Supply (RF Power Supply, DC Power Supply, Plasma Power Supply, Etc.), Stepper Motor / Motion Control / Servo Motor, Pump / Semiconductor Valve / Pressure, Electrostatic Chuck, Flow Meter, Machine Vision, Sensor, Linear Motor, etc.
Wide Bandgap Semiconductor and Power Device
Silicon Carbide (SiC), Gallium Nitride (GaN), Diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), Graphite and Carbon Materials, Power Device, etc.
Exhibit Profile
Visiting Companies
Conferences
Fairground Map
