About IICIE
The former "Shenzhen International Semiconductor & IC Exhibition （SEMI-e）" has been officially upgraded to the International Integrated Circuit Innovation Expo (IICIE 2026)! With the theme of "Cross-Industry Integration · Full-Chain Collaboration: Building a Distinctive IC Ecosystem", it is dedicated to building a high-end platform for the entire semiconductor industry chain, connecting global resources, and empowering collaborative innovation and value realisation of the global semiconductor industry.
Covering the full industry ecosystem, including IC products and applications, wafer manufacturing, packaging and testing, semiconductor equipment, semiconductor materials and key components. The expo enables direct engagement with key players in core semiconductor sectors including IDM, Fabless, Fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, optoelectronics, new energy and other fields, delivering one-stop efficient business connections, precise matchmaking and cutting-edge industry exchanges.
Covering the full industry ecosystem, including IC products and applications, wafer manufacturing, packaging and testing, semiconductor equipment, semiconductor materials and key components. The expo enables direct engagement with key players in core semiconductor sectors including IDM, Fabless, Fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, optoelectronics, new energy and other fields, delivering one-stop efficient business connections, precise matchmaking and cutting-edge industry exchanges.
Time: September 9-11, 2026
Venue: Shenzhen World Exhibition and Convention Center, China
Theme Pavilion
-
IC Products, Packaging and Testing IC Chips, Design/Electronic Design, Automation Services (EDA&IP), Outsourced Semiconductor Assembly and Testing Services (OSAT), Packaging Equipment/Test Equipment, Packaging Materials and Consumables/Core Components, Theme Zones (AI Computing Power and Application, Advanced Packaging, Advanced Computing) -
IC FabricationIC Fabrication & Foundry, IC Manufacturing Equipment, Metrology Equipment, Substrate & Manufacturing Materials & Consumables, Core Components & Parts, Theme Zone (Achievements from Universities & Research Institutes) -
Compound SemiconductorPower Devices and Modules, Materials and Substrates, Manufacturing Equipment, Packaging and Testing Equipment, Core Components, Theme Zone (Automotive Chip And Power Semiconductor)
Exhibitor Profile
-
ChipAI chips, communication chips, memory chips, CPU chips, sensor chips, analog chips, digital chips, power management and power chips, RF chips, driver chips, etc. -
Design / ManufacturingIP/EDA (Electronic Design Automation), fabless, foundry, OSAT (Outsourced Semiconductor Assembly and Testing), testing services, etc. -
Semiconductor Equipmentmanufacturing equipment, packaging equipment, inspection and test equipment, assembly equipment, environmental control equipment, factory automation / robot, etc. -
Semiconductor Materialsubstrate material, manufacturing material, packaging material, etc. -
Semiconductor Core Partssealing ring, precision bearing, metal part, quartz /silicon / SiC (Silicon Carbide) / ceramic component, power supplies (RF power supply, DC power supply, plasma power supply, etc.), stepper motor / motion control / servo motor, pump / semiconductor valve / pressure, electrostatic chuck, flow meter, machine vision, sensor, linear motor, etc. -
Wide Bandgap Semiconductor and Power DeviceSilicon Carbide (SiC), Gallium Nitride (GaN), diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), graphite & carbon material, power device, etc.
Co-located Event
IICIE 2026 (International Integrated Circuit Innovation Expo) and CIOE will be held concurrently this year, jointly presenting a 320,000 sqm showcase of optoelectronic and semiconductor industry chains.
The 27th China International Optoelectronic Exposition (CIOE 2026) showcases core products and technologies in the semiconductor industry chain, such as sensors and optoelectronic devices, including optoelectronic chips, optical components, optical modules, optical lenses, LiDAR, 3D vision, etc. The co-located event works in tandem to serve a wide range of professionals from multiple intersecting fields, including semiconductor manufacturing, display, data centers, and automotives, providing one-stop and efficient empowerment to key downstream areas.
The 27th China International Optoelectronic Exposition (CIOE 2026) showcases core products and technologies in the semiconductor industry chain, such as sensors and optoelectronic devices, including optoelectronic chips, optical components, optical modules, optical lenses, LiDAR, 3D vision, etc. The co-located event works in tandem to serve a wide range of professionals from multiple intersecting fields, including semiconductor manufacturing, display, data centers, and automotives, providing one-stop and efficient empowerment to key downstream areas.
Program
IICIE will concurrently hold over 20 forums and conferences, focusing on critical topics such as Chips & Chip Design, Wafer Fabrication & Advanced Packaging, Compound Semiconductors & Power Devices, and Intelligent Manufacturing. These forums will showcase the technologies and achievements of the integrated circuit industry. Through face-to-face interactions and in-depth technical discussions, they offered valuable insights and key references to support enterprises in their strategic planning and development. Conference List
Subscribe Us
To better understand IICIE, exhibitors and showcase products, we will provide a series of semiconductor product brochures, and regularly send the latest industry information, exhibition information, industry reports, etc.
Key Visiting Companies
- Wafer Fabrication / Foundry and Packaging & Testing SAMSUNG SEMI, SK HYNIX, SMIC, HUAHONG GROUP, CR MICRO, YANGTZE MEMORY, SILAN MICROELECTRONICS,HUALI MICROELECTRONICS, CANSEMI TECHNOLOGY, ZENSEMI, XMC, GLOBALFOUNDRIES, PENGXIN MICROELECTRONICS, PENGXINXU SEMICONDUCTOR, RUNPENG SEMICONDUCTOR, JCET GROUP, TONGFU MICROELECTRONICS, HT-TECH, WISE ROAD PACKAGING AND TESTING, SHENZHEN KAIFA TECHNOLOGY, SCI, TIANCHENG ADVANCED TECHNOLOGY...
- Chip and Chip Design MICROSOFT, QUALCOMM, NVIDIA, BROADCOM, HISILICON, C*CORE TECHNOLOGY, UNISOC, FMSH, GIGADEVICESEMICONDUCTOR, INGENIC, GOODIX TECHNOLOGY, MEDIATEK, SHANGHAI BELLING, STMICROELECTRONICS,NXP SEMICONDUCTORS, INFINEON, CAMBRICON, HORIZON ROBOTICS, SYNOPSYS, LONGSYS, MINDMOTIONMICROELECTRONICS, DOSILICON, CHIPONE, GALAXYCORE, ZTE MICROELECTRONICS, CR MICRO...
- Semiconductor Equipment NAURA, AMEC, ZHEJIANG JINGSHENG MECHANICAL & ELECTRICAL, ACM, BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, HANGZHOU CHANGCHUAN TECHNOLOGY, PIOTECH, HWATSING TECHNOLOGY, PNC TECHNOLOGY, JINGCE ELECTRONIC, JINGYI EQUIPMENT, KINGSEMI, SKYVERSE, TZTEK, HUAFENG TEST & CONTROL TECHNOLOGY, SIDEA SEMICONDUCTOR, KINGSTONESEMICONDUCTOR, SICARRIER...
- Industrial LUXSHARE, HAN'S LASER, HAN'S CNC, YASKAWA, CHOTEST TECHNOLOGY, MEGMEET ELECTRICAL, DOBOT, S.C NEW ENERGY TECHNOLOGY, ESTUN AUTOMATION, GOOGOL TECHNOLOGY, PUDU TECH, JIATEN INSTRUMENT, TEXAS INSTRUMENTS, OMRON AUTOMATION, DEWAR TECH, YUDIAN AUTOMATION TECHNOLOGY, LENS TECHNOLOGY, HUAWEI MACHINE...
Fairground Map
Exhibitor List
Product List
