Exhibition Area(sqm)
Exhibitors
Professional Visitors
Conferences
IC Products, Packaging and Testing
IC Chips, Design/Electronic Design, Automation Services (EDA&IP), Outsourced Semiconductor Assembly and Testing Services (OSAT), Packaging Equipment/Test Equipment, Packaging Materials and Consumables/Core Components, Theme Zones (AI Computing Power and Application, Advanced Packaging, Advanced Computing)
IC Fabrication
IC Fabrication & Foundry, IC Manufacturing Equipment, Metrology Equipment, Substrate & Manufacturing Materials & Consumables, Core Components & Parts, Theme Zone (Achievements from Universities & Research Institutes)
Compound Semiconductor
Power Devices and Modules, Materials and Substrates, Manufacturing Equipment, Packaging and Testing Equipment, Core Components, Theme Zone (Automotive Chips And Power Semiconductor)
Chip
AI chips, communication chips, memory chips, CPU chips, sensor chips, analog chips, digital chips, power management and power chips, RF chips, driver chips, etc.
Design / Manufacturing
IP/EDA (Electronic Design Automation), fabless, foundry, OSAT (Outsourced Semiconductor Assembly and Testing), testing services, etc.
Semiconductor Equipment
manufacturing equipment, packaging equipment, inspection and test equipment, assembly equipment, environmental control equipment, factory automation / robot, etc.
Semiconductor Material
substrate material, manufacturing material, packaging material, etc.
Semiconductor Core Parts
sealing ring, precision bearing, metal part, quartz /silicon / SiC (Silicon Carbide) / ceramic component, power supplies (RF power supply, DC power supply, plasma power supply, etc.), stepper motor / motion control / servo motor, pump / semiconductor valve / pressure, electrostatic chuck, flow meter, machine vision, sensor, linear motor, etc.
Wide Bandgap Semiconductor and Power Device
Silicon Carbide (SiC), Gallium Nitride (GaN), diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), graphite & carbon material, power device, etc.