THE 7TH SHENZHEN INTERNATIONAL SEMICONDUCTOR EXHIBITION

Shenzhen World Exhibition and Convention Center, China
September 10-12, 2025
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About SEMI-e

The 7th Shenzhen International Semiconductor Exhibition (SEMI-e) will be held at the Shenzhen World Exhibition and Convention Center from September 10 to 12, 2025. As a highly influential and professional semiconductor exhibition in the industry, SEMI-e 2025 is at the forefront of the industry, spanning the upstream and downstream of the industry chain.It will gather more than 900 quality exhibitors, covering an exhibition area of 60,000 m².It’ll showcase a wide range of products including chips

and chip design, semiconductor equipment, semiconductor material, advanced packaging, semiconductor core parts, wide bandgap semiconductor and power device, and AI computing power, etc. It is committed to creating a multi-dimensional technology event covering the entire semiconductor industry chain. SEMI-e will be held concurrently with China International Optoelectronic Exposition (CIOE), jointly creating a super event of optoelectronic technology and the semiconductor industry with a scale of 320,000 square meters. The cooperation of the two exhibitions not only deeply improves the layout of the semiconductor industry chain but also forms a solid foundation where the upstream and downstream industry chains rely on each other and develop synergistically, jointly contributing to the prosperity of the application market.

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Why Choose the South China Market?

1.

South China has a complete electronic information industry chain, and the demand for semiconductors continues to grow.
2.

Semiconductor enterprises in South China cover all aspects such as design, manufacturing, packaging, and testing, forming an entire industry chain.
3.

Well-known domestic and foreign wafer manufacturing enterprises have established production bases or R&D centers in South China, forming a relatively complete wafer manufacturing industry system.

South China has initially formed an industrial layout with packaging & testing, and design as the core, featuring the third-generation semiconductors.

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Highlights

1.

Showcase the latest innovative technologies and achievements in the semiconductor industry.
2.

Focus on the core industrial chain of wide bandgap semiconductors and power devices.
3.

From design, research and development to the application, concentrate on the applications of "chip".
4.

The cohost of the two exhibitions improves the layout of the semiconductor industry chain and realizes seamless connection between upstream and downstream industries.

5.

The two exhibitions empower each other, enabling in-depth connection with more than 160,000 professional peers in the application fields.
6.

Multi-dimensional forums held concurrently present industry trends and technological applications.
7.

The year-round brand promotion is carried out to enable exhibitors establish high-quality business connections with global buyers.

Theme Zones

Semiconductor Manufacturing and Advanced Packaging

Chip and
Chip Design

AI Computing
Power

Semiconductor
Core Part

Wide Bandgap Semiconductor and Power Device

Exhibit Profile

Chip and Chip Design

Chip Design, Communication Chip, Memory Chip, CPU Chip, Sensor Chip, Analogue Chip, Digital Chip, Power Management & Power Chip, RF Chip, Driver Chip;
AI Computing Power

AI Chip, Server, Switch, Power Supply, Liquid Cooling and Temperature Control;
Semiconductor Equipment

Manufacturing Equipment, Packaging Equipment, Inspection and Test Equipment, Assembly Equipment, Facilities, Pollution Control Equipment, Processing Equipment, General Equipment；
Semiconductor Material

Manufacturing Material, Packaging Material, Wafer / Substrate Material;
Advanced Packaging

Flip Chip Packaging, Wafer Level Packaging, 2.5D Packaging, 3D Packaging, Bump Packaging, Fan-out Wafer Level Packaging;
Wide Bandgap Semiconductor & Power Device

Silicon Carbide, Gallium Nitride, Diamond, Gallium Oxide, Cubic Boron Nitride, Aluminium Nitride, Graphite & Carbon Material, Equipment & Supporting Facilities, Power Device.
Semiconductor Core Part

Sealing Ring, Precision Bearing, Metal Part, Quartz / Silicon / SiC / Ceramic Component, Power Supply (RF Power Supply, DC Power Supply, Plasma Power Supply, etc.), Stepper Motor, Motion Control, Servo Motor, Pump / Semiconductor Valve / Pressure, Electrostatic Chuck, Flow Meter, Machine Vision, Sensor;

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Co-located Event

SEMI-e (the 7th Shenzhen International Semiconductor Exhibition) and CIOE will be held concurrently this year, jointly presenting a 320,000 sqm showcase of optoelectronic and semiconductor industry chains.

Enhancing semiconductor industry chain integration through co-located exhibitions, with CIOE's complete optoelectronics value chain featuring exhibitors from seven Chinese Academy of Sciences institutes and top manufacturers of photonic chips, optical modules, sensors, and lasers, thereby enabling seamless downstream connectivity for SEMI-e.

Synergistically serving diverse cross-industry applications spanning display, data center, automotive and other sectors through integrated exhibition platforms that deliver comprehensive solutions for downstream innovation.

Floor Plan

Visitor Registration

As a multi-dimensional technology event covering the entire semiconductor industry chain, SEMI-e brings together well-known enterprises in the industry and will attract more than 160,000 professional visitors from various application fields such as semiconductor manufacturing, new energy vehicles, AR&VR, communications, consumer electronics, medical, displays, and advanced manufacturing. It will bring you the most cutting-edge technologies, the best products, and the deepest industry insights. Here, you will have a one-stop experience of advanced technological achievements in the optoelectronic and semiconductor fields and accurately grasp the industry market dynamics. You will also have the opportunity to communicate face-to-face with industry experts and corporate executives, jointly explore potential cooperation opportunities.